Viavi JDSU XFP E3/DS3/STS1 DS1 PIM-KIT Physical Interface Modules

Condition: Used

Viavi JDSU XFP E3/DS3/STS1 DS1 PIM-KIT Physical Interface Modules. This kit includes Physical Interface Modules (PIMs) designed for use with Viavi/JDSU modular test platforms, providing connectivity for E3, DS3, STS-1, and DS1 electrical interface standards alongside XFP optical testing capability.

Included in the sale (as described):
• XFP E3/DS3/STS1 DS1 PIM-KIT Physical Interface Modules as shown

The images provided are of the actual item you will receive. Please review them carefully for the cosmetic condition and what is included in the sale.

Viavi Solutions (formerly JDSU) Physical Interface Modules (PIMs) are plug-in interface adapters designed for use with Viavi modular test platforms such as the T-BERD/MTS series. They allow field technicians to connect the test instrument to the specific interface type under test, supporting a wide range of optical and electrical standards without requiring separate dedicated test sets.

The XFP E3/DS3/STS1 DS1 PIM-KIT is designed to support both 10G optical (XFP) and legacy electrical interface testing, including E3, DS3, STS-1, and DS1 standards — making it a versatile kit for mixed-technology network environments.

Key characteristics:
Interface Standards Supported: E3, DS3, STS-1, DS1 (electrical) and XFP (10G optical)
Form Factor: Plug-in Physical Interface Module (PIM)
Compatible Platforms: Viavi/JDSU T-BERD/MTS modular test platforms
Design: Hot-swappable, field-deployable plug-in module
Application: Multi-rate transmission testing, network commissioning, and fault diagnosis

Please refer to the Viavi Solutions manufacturer website for full and up-to-date specifications.